最新消息

Keyence Hits Record Highs in Fiscal Year 2025 Driven by Global Automation Demand
Keyence fiscal year 2025 record sales reached 1.169 trillion yen, driven by global automation demand and innovative products.

Toyota Transport Launches Field Trials for Next-Generation Solar-Powered Car Haulers
The next-generation solar car haulers trial by Toyota Transport focuses on fuel efficiency and emission reduction through advanced solar technology.

Kyocera Unveils Low-Warpage Multilayer Ceramic Core Substrates for Next-Generation AI Packaging
Low-warpage ceramic substrates for AI packaging are critical for enhancing semiconductor performance and reliability in advanced data centers.

SK hynix Shatters Records in Q1 2026: AI Memory Boom Drives Historic Revenue and Profit Surge
SK hynix AI memory revenue growth has transformed the semiconductor landscape with record earnings in Q1 2026, driven by AI investments.

Elon Musk Bets Big on Compute Sovereignty: Inside the $119 Billion Terafab Semiconductor Megaproject
Elon Musk Terafab semiconductor project marks a significant investment reshaping the tech landscape with $119B aimed at enhancing compute sovereignty.

India Enters New Era of Semiconductor Localization with Massive Policy Push
India semiconductor localization policy is transforming the country's semiconductor sector, enhancing manufacturing capabilities significantly.

Hiroshima University Breakthrough Resolves Long Standing Trade Off in Organic Photovoltaics
The organic photovoltaics breakthrough by Hiroshima University promises improved renewable energy efficiency, minimizing energy loss.

STMicroelectronics Unveils 800V Direct Power Conversion for AI Data Centers
The 800V direct power conversion for AI data centers enhances energy efficiency and meets the growing demands of AI workloads.

Tohoku University Simplifies Oxide-Based All-Solid-State Battery Production
The article discusses advancements in oxide-based all-solid-state battery production by Tohoku University, emphasizing a novel bonding method that enhances interface stability.
