In the rapidly evolving landscape of semiconductor manufacturing, process control and yield management are paramount. Hamamatsu Photonics has announced a significant breakthrough in metrology technology with the development of its new "HyperGauge" Thickness Measurement System (Model C17319-11). This advanced device is capable of measuring the film thickness across the entire surface of a three hundred millimeter wafer in just five seconds, setting a new standard for speed and efficiency in the industry.
Revolutionary Lambda-Capture Technology
At the core of this innovation lies Hamamatsu's proprietary wavelength detection technology known as "Lambda-Capture." Unlike traditional methods that rely on time-consuming point-by-point scanning using spectrometers, Lambda-Capture utilizes high-sensitivity cameras to perform spectral imaging across the entire field of view simultaneously. This allows the system to capture the full wafer map instantly, dramatically reducing the time required for inspection.
Enhanced Precision and Ease of Use
The new system addresses several pain points associated with conventional point-sensor methods. Because it performs simultaneous wafer mapping and thickness measurement, it eliminates the complex and slow process of selecting measurement points and mechanical alignment. The device offers high resolution and exceptional measurement reproducibility, making it versatile enough for inspecting both bare silicon wafers and complex patterned wafers.
Broad Applications for Yield Improvement
This technology is particularly well-suited for a wide range of critical applications, including:
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Observing film thickness uniformity on wafers with process variations.
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Evaluating ultra-thin films where precision is critical.
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Analyzing structures on patterned wafers during various fabrication stages.
