Onsemi has officially launched its latest "EliteSiC MOSFET" series in December 2025, introducing a breakthrough in cooling packaging technology. Designed specifically for demanding applications such as electric vehicle chargers, solar power inverters, and industrial power supplies, these new components address one of the most critical challenges in power electronics: thermal management.
The core innovation lies in the fusion of Onsemi's high-performance Silicon Carbide technology with the advanced "T2PAK" top-cool packaging. Unlike traditional designs that dissipate heat down through the printed circuit board, the T2PAK package allows heat to be transferred directly from the top of the chip to the system's heat sink. This direct thermal path significantly reduces thermal resistance and prevents heat buildup within the PCB itself.
Available in voltage ratings of 650 Volts and 950 Volts, these MOSFETs enable engineers to design systems that are not only more efficient but also compact. By eliminating the need for complex thermal vias in the circuit board, manufacturers can achieve higher power density and simplified mechanical designs.
Onsemi has confirmed that initial shipments to key customers have already begun. Mass production and the release of additional product variations are scheduled to ramp up from the fourth quarter of 2025 onwards. This launch marks a significant step forward in the efficiency of renewable energy infrastructure and electric mobility.
