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Two-Track Growth: The Divergence of Advanced and Legacy Silicon Wafer Markets in 2025
The global silicon wafer industry reached a significant inflection point in 2025, according to the latest data from the Silicon Manufacturers Group (SMG) of SEMI. While the total shipment area saw ...
JX Metals to Triple Indium Phosphide Substrate Production to Fuel the Generative AI Revolution
In February 2026, JX Metals Corporation announced a significant strategic move to address the surging demands of the artificial intelligence era. The company is investing approximately 20 billion J...
ROHM Secures Gallium Nitride Independence through TSMC Technology License
Japanese semiconductor giant ROHM has officially announced a strategic licensing agreement with Taiwan Semiconductor Manufacturing Company, also known as TSMC, regarding Gallium Nitride power devic...
China’s Semiconductor Equipment Imports Hit Record $34.7 Billion in 2025
In a landmark development for the global tech supply chain, China’s imports of semiconductor manufacturing equipment reached an all-time high of 34.7 billion dollars in 2025, marking a three percen...
STMicroelectronics Expands Gallium Nitride Footprint and Shifts Silicon Carbide to Eight-Inch Wafers
STMicroelectronics is taking significant steps to solidify its leadership in the power semiconductor market by expanding its Gallium Nitride (GaN) business and accelerating the transition of Silico...
Samsung Semiconductor Hits Record Highs: HBM Sales Set to Triple by 2026
Samsung Electronics has officially ushered in a new era for its semiconductor division. In the fourth quarter of 2025, the company reported a staggering revenue of 44 trillion Korean Won, marking a...
Toshiba推出新一代栅极驱动技术：将碳化硅开关损耗降低28%
2026年2月17日，Toshiba 宣布在功率半导体效率方面取得重要突破，开发出两种专为碳化硅功率器件设计的下一代门极驱动技术。这一创新解决了高速功率电子领域最顽固的挑战之一：开关速度与电磁噪声之间的权衡。通过实现28% 的开关损耗降低，Toshiba 正为更高效的电动汽车动力系统和可持续的数据中心基础设施铺平道路。
此次突破的核心在于新的反馈型有源门极驱动技术。传统门极驱动器在高速运行时...
TSMC将熊本二厂升级至3纳米制程以满足全球人工智能需求
Taiwan Semiconductor Manufacturing Company，作为先进芯片制造的全球领导者，已正式宣布对其在日本的业务进行重大战略调整。公司的子公司 Japan Advanced Semiconductor Manufacturing 将把位于熊本的第二生产设施升级为 3 nanometer 工艺。此举标志着相较于最初计划的 12 nanometer 和 6 nan...
韩国将建设新核反应堆，为人工智能与半导体革命提供电力
随着全球在人工智能主导地位方面的竞争加剧，为这场数字革命提供能量已成为关键的战略资源。作为半导体制造的全球强国，韩国正采取果断措施保障其能源未来。韩国政府已正式确认计划在2038年前建造两座大规模核反应堆和一座小型模块化反应堆，以满足来自人工智能数据中心和在该国建设的大规模半导体集群日益增长的用电需求。
这一需求的中心是龙仁半导体集群，这是一个宏大的工业项目，三星电子和SK hynix等行业...
