China Aims for 6.5 Million Monthly Silicon Wafer Capacity by 2030
China silicon wafer production expansion is set to achieve significant milestones by 2030. The country plans to increase its silicon wafer capacity considerably.
The semiconductor landscape in China is undergoing a massive transformation as the nation aggressively expands its silicon wafer production capabilities. According to recent industry projections, China’s 300-millimeter silicon wafer monthly production capacity is expected to reach 3.7 million units by 2026, marking a 19 percent year-over-year increase. Looking further ahead to 2030, this capacity is forecasted to soar to 6.5 million units per month.
This strategic expansion aims to achieve complete domestic self-sufficiency. By 2030, the demand from China's domestic 300-millimeter semiconductor fabrication plants is estimated at 3.7 million units. If wafer manufacturers allocate approximately 60 percent of their total capacity to domestic chipmakers, the goal of 100 percent localization can be realized. Notably, the industry is moving beyond legacy nodes. While localization rates for equipment and materials in the 14-nanometer and above generations are already high, there is a concerted effort to secure a domestic supply chain for advanced 7-nanometer to 5-nanometer generations.
Key players are driving this growth with ambitious roadmaps. By 2030, ESWIN aims for a monthly capacity of 1.5 million units, followed by Zingsemi at 1.2 million units, and TCL Zhonghuan at 1 million units. These top three manufacturers alone will contribute 3.7 million units, while the top six combined are projected to reach 5.5 million units per month, solidifying China's footprint in the global semiconductor materials market.
