1, Ultra Thinning / Ultra Flat
MEMS / SENSOR / IGBT / SAW / SOI / GWSS / Polish Wafer / Cavity etc;
Ultra-thin processing such as thickness 1-10um;
Silicon wafer is ultra-thinned to about 5um;
Ultra-thin LT Wafer to about 1um;
2, Wafer Cleaning
Particle:≦10ea/WF(≧0.3μm)
Metal contamination after cleaning 
3, Edge Grining
Knife edge prevention processing
Processing Wafer Size: 4・5・6・8inch
