SCREEN Semiconductor Solutions has announced an expanded agreement with IBM to develop cleaning processes specifically for next-generation Extreme Ultraviolet (EUV) lithography. Building upon their joint development efforts initiated in November 2022, this expanded contract aims to significantly accelerate the resolution of critical issues associated with High-Numerical Aperture (High-NA) EUV, a technology deemed indispensable for manufacturing beyond the 2nm process node.
The transition to High-NA EUV dramatically elevates the importance of the cleaning process. Minute contaminants and microscopic defects that were previously negligible can now significantly impair the exposure process. This heightened sensitivity means that impeccable wafer cleaning is paramount to the success of this advanced lithography technique.
SCREEN intends to leverage the challenges and insights gained from this collaborative development to refine its proprietary cleaning processes and equipment. The ultimate goal is to seamlessly integrate this crucial feedback into the development of its next-generation cleaning tools, ensuring they meet the stringent demands of the most advanced semiconductor manufacturing processes. This partnership underscores the industry's continuous drive toward overcoming physical limitations and enabling the future of semiconductor technology.
