Diamond Wafer Orientation 100 Double side polished Semiconductor Substrate - Soka Technology
Diamond Wafer Orientation 100 Double side polished Semiconductor Substrate - Soka Technology

SOKA TECHNOLOGY

Diamond Wafer Orientation 100 Double side polished Semiconductor Substrate

Angebotspreis$1,375.00
Size:5x5x0.3mm
Number Of Item:5 Items
Menge:
♦️High-quality SiC wafer for Research and Experiment.
♦️Provide small quantities, special specifications products, and customized services.
♦️Global shipping, secure payment, large inventory.
♦️Minimum delivery time within 1 week. Shipped by FedEx, DHL,UPS, etc.
Diamond Substrate Specification:
  • Size: 5mmx5mm;
  • Composition: Carbon;
  • Orientation: 100;
  • Thickness: 0.3mm;
  • Refractive Index: 2.42;
  • Relative density:3.52;
  • Dispersion: 0.044;
  • Hardness: 90 GPA;
  • Thermal conductivity: ≥2000;
  • Surface finish: Double Side Polish;
  • Packing: Wafer Container;



Email

info@sokatec.com

Email

info@sokatec.com

Warranty

Guarantee product quality.

Warranty

Guarantee product quality.

Payments

We accept payment by credit card, PayPal, bank transfer etc.

Payments

We accept payment by credit card, PayPal, bank transfer etc.

Geschäftskooperation

Amerika

Contact: Sophie
Email: sophie@sokatec.com
Tel: +1-6463916255

Vereinigtes Königreich

Contact: Elsa
Email: elsa@sokatec.com
Tel: +44-7972294236

Japan

Contact: Shon
Email: shon@sokatec.com
Tel:+81-368203586

Korea

Contact: Kim
Email: kim@sokatec.com
Tel: +82-1090065688

Indien

Contact: Chraiseto
Email: chraiseto@sokatec.com
Tel: +91-9488669046

Vietnam

Contact: Ryan
Email:nguyen@sokatec.com
Zalo: +84-915750102