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Advantest Leverages AI for Enhanced Semiconductor Testing
Advantest's regional headquarters in the Americas has announced a strategic move to transform its "ACS Real-Time Data Infrastructure (ACS RTDI)," which collects and analyzes semiconductor test data...
Nagoya University and Partners Succeed in Prototyping 6-inch P-type SiC Wafers via Solution Growth Method
A research group comprising Oxide Power Crystal, Mipox, UJ-Crystal, A-Crystal, the National Institute of Advanced Industrial Science and Technology (AIST), and Nagoya University has successfully pr...
Tohoku University and NIMS Breakthrough: A Robust Amorphous Oxide Cathode for Magnesium Rechargeable Batteries
Researchers from Tohoku University and the National Institute for Materials Science (NIMS) have successfully developed an amorphous oxide cathode material for Magnesium Rechargeable Batteries (RMBs...
Ricoh Accelerates Mass Production of Perovskite Solar Cells: Targeting Over 300 MW Annual Output by FY2030
Ricoh is actively developing mass production technology for Perovskite Solar Cells (PSC) leveraging the Green Innovation Fund from NEDO (New Energy and Industrial Technology Development Organizatio...
Poland Eager to Boost Semiconductor Production, Strengthening European Cooperation
The Polish Investment and Trade Agency recently hosted the "Poland-Japan Investment Forum," an event designed to introduce Japanese companies and investors to Poland's support systems and investmen...
NAND SSD Prices Continue to Surge: Data Center Demand and Supply Constraints Drive Q4 Forecast
According to TrendForce, a respected research firm, the contract price for enterprise NAND flash memory is projected to see a 5-10% rise quarter-over-quarter in the October-December 2025 period. Th...
Mitsubishi Electric Ramps Up SiC Capacity with New 8-Inch Facility
Mitsubishi Electric has marked a significant milestone in its power device strategy with the completion of a new 8-inch Silicon Carbide (SiC) manufacturing facility at its Shisui Plant in Kikuchi C...
SCREEN and IBM Forge Deeper Partnership to Tackle Next-Gen EUV Challenges
SCREEN Semiconductor Solutions has announced an expanded agreement with IBM to develop cleaning processes specifically for next-generation Extreme Ultraviolet (EUV) lithography. Building upon their...
Kyoto Institute of Technology Focuses on CH4 Utilization in GaN Etching Process
The Kyoto Institute of Technology (KIT) has recently turned its attention to a GaN etching process utilizing methane (CH4) plasma, which holds significant promise for reducing environmental impact....
