LG Innotek made a significant impact at the KPCA Show 2025, drawing considerable attention with the debut of its Cu Post technology, designed for next-generation mobile package substrates. This innovative technology is a game-changer in the world of miniaturization and performance.
The Cu Post technology fundamentally redefines substrate design by minimizing the area and size of solder balls. This crucial reduction allows for a much finer and more detailed array design on the substrate. The result is remarkable: package substrates that are up to 20% smaller than conventional products, all while maintaining equivalent performance. This leap in miniaturization is vital for the increasingly compact and powerful mobile devices of the future.
Beyond size reduction, Cu Post technology addresses a critical challenge in high-performance electronics: heat dissipation. By utilizing copper, a material with a thermal conductivity more than seven times higher than traditional materials, LG Innotek has achieved a significant improvement in heat management. Better thermal conductivity means improved overall device reliability and sustained performance, even under heavy load.
