NVIDIA has announced a major strategic initiative in collaboration with the South Korean government, aiming to significantly expand the nation's Artificial Intelligence (AI) infrastructure. This partnership centers on the deployment of over 250,000 Graphics Processing Units (GPUs) across Korea's sovereign cloud and AI data centers, setting the foundation for robust, national-level AI development.
This move is part of a broader government strategy to accelerate sovereign AI capabilities, ensuring that Korean enterprises and public institutions have access to cutting-edge computing power. The infusion of over a quarter-million GPUs will support the creation of powerful AI factories, accelerating innovation across vital sectors such as automotive, manufacturing, and telecommunications. This initiative is pivotal for South Korea as it strives to become one of the top three global AI powerhouses.
Key Partnerships Driving the AI Ecosystem
The core of this infrastructure buildout involves deep collaborations with South Korea's industrial giants:
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Samsung Electronics: The company is set to construct an advanced AI data center featuring more than 50,000 NVIDIA GPUs. This "AI factory" will revolutionize advanced chip manufacturing processes, utilizing AI-driven predictive maintenance and operational optimization. Furthermore, Samsung is strengthening its long-standing collaboration with NVIDIA by agreeing to supply next-generation High Bandwidth Memory (HBM) chips. This joint effort, which includes collaboration on cutting-edge memory solutions like HBM4, underscores a mutual commitment to pushing the boundaries of AI and semiconductor roadmaps. The companies aim to set a global benchmark for AI-driven semiconductor manufacturing at scale.
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SK Group (including SK Telecom and SK Hynix): SK Group is also planning to deploy an AI data center with over 50,000 NVIDIA GPUs. The first phase of this significant project is anticipated to be completed by late 2027. Beyond the data center, SK is collaborating with NVIDIA on next-generation memory solutions, semiconductor manufacturing advancements, and future-forward telecommunications infrastructure, including the development of intelligent, low-power AI-RAN network technology.
