SKC is making a strategic move to dominate the next generation of semiconductor packaging. The company has officially announced a capital increase of approximately 1 trillion won to bolster its financial structure and accelerate the growth of its glass substrate business. According to the plan, about 60 percent of the funds, totaling 590 billion won, will be directed toward Absolics, a subsidiary focused on high performance computing materials.
Absolics specializes in glass substrates, which are considered a game changer for Artificial Intelligence data centers. Unlike traditional plastic substrates, glass substrates offer superior flatness and thermal stability, allowing for more dense chip integration and higher energy efficiency. To gain a competitive edge, Absolics is pursuing a two track development strategy, simultaneously working on embedded and non embedded types of glass substrates. This approach aims to meet diverse customer needs and ensure a faster time to market.
The remaining 410 billion won will be used to repay existing debts, significantly improving the company’s financial health. SK Group, the major shareholder, has already expressed its intent to participate in the capital increase, showing strong confidence in the project. By the end of 2025, SKC expects its debt to equity ratio to drop from 230 percent to the low 140 percent range. As the demand for AI chips continues to surge, SKC’s aggressive investment in glass substrates positions it as a key leader in the global semiconductor ecosystem.
