The global race for next-generation semiconductor packaging is heating up, and South Korea is firmly in the lead, particularly with its aggressive development of glass core substrates. This crucial shift is being driven by the relentless demand for high-performance chips, especially those designed for AI semiconductors.
The advent of powerful AI processors necessitates larger package substrates that can handle ultra-high-speed signal processing. To meet these stringent requirements, technologies that minimize warpage and significantly enhance electrical properties are becoming indispensable. Glass, with its superior flatness, dimensional stability, and excellent electrical characteristics, is poised to replace traditional organic substrates as the material of choice.
While industry giants like Intel have notably scaled back their efforts in advanced package substrate development, competitors such as TSMC and Samsung Electronics are intensely focused on this future-forward technology. South Korea's ecosystem is also seeing the rise of agile, specialized equipment suppliers who offer turnkey solutions—a full range of equipment and processes—to expedite the development and manufacturing of these complex substrates.
A key player making waves in this space is the emerging firm JNTC. They have recently begun full-scale production of Through-Glass Via (TGV) substrates with a current monthly capacity of 10,000 units. Furthermore, JNTC is signaling its long-term ambition by planning to establish a large-scale manufacturing base in Vietnam by 2025, cementing South Korea's significant role in the advanced packaging landscape. This move not only expands their production capability but also underscores the global market's growing confidence in glass substrate technology for the future of high-performance computing.
