Ferrotec Expands Semiconductor Component Capacity with New Beijing Facility

Ferrotec Holdings Corporation has officially announced a significant investment of approximately 540 million Chinese Yuan, equivalent to about 12.2 billion Japanese Yen, to construct a high-tech manufacturing base in Beijing. This strategic move involves the establishment of three specialized subsidiary companies focused on semiconductor and flat panel display component cleaning, precision metal contract manufacturing, and advanced ceramics production.

The new facility will span a site area of approximately 20,800 square meters, with a total building area of 27,500 square meters. The investment breakdown reflects a clear priority: 300 million Yuan dedicated to the cleaning business, 160 million Yuan for metal processing, and 80 million Yuan for technical ceramics. Construction is scheduled to begin in March 2026, with the structure completed by December 2026. Equipment installation is slated for March 2027, leading to full operational status by June 2027.

This expansion is a calculated response to the shifting global supply chain. As Western customers adjust their procurement strategies, Ferrotec is securing production capacity both outside and inside China. Locally, the demand from Chinese semiconductor equipment manufacturers is surging. By strengthening its footprint in Beijing, Ferrotec aims to capture the rapid growth of the domestic chip-making ecosystem while maintaining its role as a critical global supplier of high-purity quartz, ceramic vacuum parts, and precision metal components.