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DRAM Prices Surge: Up to 13% Rise Expected in Q4 2025
The upward trend in DRAM prices continues unabated. For the fourth quarter of 2025 (October to December), traditional DRAM is projected to see a quarter-on-quarter increase of 8 percent to 13 perce...

Breakthrough in Organic Diodes: Tokyo University Achieves 1000-fold Increase in Power Conversion Efficiency
Researchers from the University of Tokyo have achieved a significant milestone in the field of organic electronics. They have successfully converted 920 MHz alternating current (AC) power into dire...

Sony Semiconductor Launches New High-Speed, High-Resolution CIS for Industrial Applications
Sony Semiconductor Solutions has introduced a new groundbreaking product for the industrial equipment sector: the IMX927 stacked CMOS image sensor. This back-illuminated sensor, equipped with a glo...

OpenAI Partners with South Korean Tech Giants for Massive DRAM Procurement and AI Infrastructure
OpenAI is charting an ambitious course for its future AI endeavors, most notably through its participation in the 'Stargate' AI infrastructure project. A pivotal step in this global strategy is the...

Kyocera and Kyoto Fusioneering Collaborate on Ceramic Components for Fusion Reactors
Kyocera Corporation and Kyoto Fusioneering Ltd. have entered into a joint development agreement concerning ceramic materials essential for fusion energy power plants. Furthermore, Kyocera has also ...

First Duck Launches Game-Changing Cleaning Agent for Wet Scrubbers
First Duck is proud to announce the commercial launch of a newly developed cleaning agent specifically engineered to tackle stubborn buildup within wet scrubbers. This innovative product is set to...

EDP Targets 4-Inch Diamond Substrate by March 2029, Accelerating Power and Quantum Device Innovation
EDP (E-D-P) is making significant strides in the development of single-crystal diamond substrates for advanced applications in semiconductors and quantum devices. The company is systematically pur...

LG Innotek Unveils Cu Post Technology and FCBGA Innovations at KPCA Show 2025
LG Innotek made a significant impact at the KPCA Show 2025, drawing considerable attention with the debut of its Cu Post technology, designed for next-generation mobile package substrates. This inn...

ROHM's 2-in-1 SiC Module Contributes to Equipment Miniaturization
ROHM has recently unveiled a significant advancement in power electronics with the development of a 2-in-1 Silicon Carbide (SiC) module, cleverly designed by linking two separate packages. This inn...
