The global market for Silicon Carbide bare wafers is poised for explosive growth over the next decade. According to the latest research from Fuji Keizai, the market is projected to reach 572.4 billion Yen by 2035, marking a nearly threefold increase compared to 2025 estimates. This surge is primarily fueled by the rapid transition from 6-inch to 8-inch wafer technology, which offers significant cost efficiencies and higher yields for power semiconductor manufacturing.
While 6-inch Silicon Carbide wafers currently dominate the production lines, the landscape is shifting faster than previously anticipated. The 8-inch segment is expected to soar to 370 billion Yen by 2035, a staggering 6.7-fold increase from 2025 levels. This acceleration is largely driven by Chinese manufacturers, who commenced mass production of 8-inch substrates around 2024. This early entry has forced global leaders to expedite their capacity expansions to maintain competitiveness in the electric vehicle and renewable energy sectors.
Interestingly, the application of Silicon Carbide is expanding beyond traditional power electronics. A notable milestone occurred in 2024 when Meta adopted semi-insulating Silicon Carbide wafers for Augmented Reality glass lenses. This move highlights the material's superior optical properties and high thermal conductivity, opening new revenue streams in the consumer electronics and wearable technology markets. As the industry scales, the maturity of 8-inch fabrication will be the decisive factor in reducing the overall cost of Silicon Carbide power modules.