LG Innotek Partners with UTI to Revolutionize Glass Substrates for FCBGA

LG Innotek, a global leader in electronic components, has officially announced a strategic joint research agreement with UTI, a specialist in precision glass processing. This collaboration aims to accelerate the development of glass substrate technology, a next-generation material platform destined to redefine the high-end semiconductor packaging market.

By integrating UTI’s advanced glass thinning and strengthening capabilities—originally perfected for mobile devices—with LG Innotek’s leadership in Flip Chip Ball Grid Array (FCBGA) substrates, the two companies seek to overcome the physical limitations of traditional organic materials. Glass substrates offer superior flatness and heat resistance, allowing for much larger packaging areas and finer circuit patterns without the risk of warping.

Industry data suggests that the glass substrate market is poised for explosive growth as Artificial Intelligence and high-performance computing demand more efficient chip-to-chip interconnects. Unlike conventional plastic substrates, glass reduces signal loss and improves power efficiency significantly. LG Innotek plans to apply these findings to its flagship FCBGA products, securing a dominant position in the race for AI-ready hardware solutions. This partnership represents a critical pivot toward materials that can handle the thermal and structural demands of future data centers and high-speed communication networks.