In a significant move to accelerate its restructuring and reinforce its market leadership, Wolfspeed has officially commenced the external sales of its advanced 200mm Silicon Carbide (SiC) wafers. This strategic decision is aimed at supporting the development efforts of power semiconductor manufacturers across the globe.
Previously, the 200mm wafers were primarily reserved for Wolfspeed's internal consumption and a select group of customers. By expanding this to full-scale external sales, the company is directly addressing the industry’s need for larger format SiC substrates. The shift to 200mm wafers offers substantial benefits to device makers, including improved yield, shorter time-to-market, and the ability to provide more competitive solutions. This larger format is a critical enabler for the next generation of high-efficiency power electronics.
This commercial expansion is happening even as the US-based company undergoes a financial restructuring. Wolfspeed filed for Chapter 11 bankruptcy at the end of June, but its reorganization plan has been approved by the court, and the company is expected to emerge from the proceedings in September. Upon exiting Chapter 11, Wolfspeed anticipates reducing its debt by approximately 70%, which will provide significant financial flexibility. This strong financial foundation will allow the company to further solidify its technological and manufacturing leadership in the rapidly growing SiC sector.
