Processing material
1.Silicon wafer
2.Sapphire wafer
3.Glass wafer
4.SiC wafer
5.AlN
6.Alumina
Wafer Drilling Processing
1.Drilling
2.Micro-holes (approximately 0.1mm diameter and smaller)
3.Deep holes (aspect ratios of 10:1 or greater available)
4.High-precision alignment
5.Grooving/Surface Processing
6.Micro-grooves, through-holes
7.Surface milling/engraving
8.Lettering/logo processing (laser or machine processing)
9.Cleaning/Finishing
Contact us
America
Contact:Sophie
sophie@sokatec.com
Tel:+1-6463916255
England
Contact: Elsa
elsa@sokatec.com
Tel:+44-7972294236
Germany
Contact: Shan
shan@sokatec.com
Tel:+49-17647655770
Japan
Contact: Shon
sales@sokatec.com
Tel:+81-368203586
Korea
Contact: Kim
kim@sokatec.com
Tel:+82-1090065688
India
Contact:Chraiseto
chraiseto@sokatec.com
Tel:+91-9488669046
Vietnam
Contact:Hieuoggy
nguyen@sokatec.com
Zalo:+84-915750102
