Okamoto Glass has officially announced a significant strategic expansion in the field of semiconductor materials. The company plans to invest over 900 million yen to bolster its manufacturing equipment for "green sheets," a critical component in the production of Aluminum Nitride heat dissipation substrates. This move strengthens their ongoing collaboration with U-MAP, a high-tech startup spun out of Nagoya University.
In the rapidly evolving world of power electronics, heat management is a critical bottleneck. As devices become smaller and more powerful, particularly in sectors like Electric Vehicles (EVs), 5G telecommunications, and high-performance computing, the need for efficient thermal management solutions has skyrocketed. The collaboration between Okamoto Glass and U-MAP addresses this exact challenge.
The core of this innovation lies in a proprietary material developed by U-MAP called "Thermalnite." Thermalnite is a fibrous single crystal of Aluminum Nitride. Unlike traditional spherical fillers, this fibrous structure allows for a unique application. When Thermalnite is mixed into ceramics or insulating resins, it creates a highly efficient pathway for heat to escape.
Data indicates that the performance gains are substantial. Adding just ten percent of Thermalnite to conventional electronic materials can improve thermal conductivity by ten times. This is a game-changer for the industry, as it allows for the creation of smaller, lighter, and more durable electronic components.
Okamoto Glass is leveraging its expertise in special glass manufacturing to scale up the production of these high-performance substrates. The investment will specifically target the production capacity of green sheets—the unfired ceramic tapes that form the base of the final substrate. By securing this supply chain, Okamoto Glass aims to meet the growing global demand for next-generation thermal solutions.
This investment marks a pivotal moment for the semiconductor materials market, signaling a shift towards advanced composite materials that can handle the thermal loads of future technology.
