Wafer Drilling Processing

Processing material

1.Silicon wafer

2.Sapphire wafer

3.Glass wafer

4.SiC wafer

5.AlN

6.Alumina

Processing details

1.Drilling

2.Micro-holes (approximately 0.1mm diameter and smaller)

3.Deep holes (aspect ratios of 10:1 or greater available)

4.High-precision alignment

5.Grooving/Surface Processing

6.Micro-grooves, through-holes

7.Surface milling/engraving

8.Lettering/logo processing (laser or machine processing)

9.Cleaning/Finishing

10.Ultrasonic cleaning