News

Manufacturing of 300mm silicon carbide for AI packaging in a high-tech cleanroom.

Wolfspeed Unveils 300 Millimeter Silicon Carbide for AI Packaging

Silicon carbide for AI packaging is paving the way for high-performance computing innovations, driven by Wolfspeed's advancements in technology.
near-infrared visible light conversion technology experiment showing efficiency measurements and light emission.

Breakthrough in Near-Infrared to Visible Light Conversion Efficiency

The near-infrared visible light conversion technology developed by researchers at Rikkyo University achieves record efficiency in converting infrared to visible light.
South Korea semiconductor exports AI memory demand highlighted in record high shipping at Incheon International Airport.

South Korea’s Semiconductor Exports Hit Record High Driven by AI Memory Demand

South Korea semiconductor exports AI memory demand have soared, marking a record high in February 2026 with an impressive export value driven by AI technology.
Interior view of a 2nm semiconductor manufacturing Austin facility highlighting projected capacity of 100,000 wafers per month.

Musk’s Empire to Build "TERAFAB": A 2nm Vertical Semiconductor Revolution in Austin

2nm semiconductor manufacturing Austin marks a significant leap with Musk's TERAFAB facility in Austin, aiming to reshape the semiconductor landscape.
BYD Blade Battery and FLASH Charging technology with thermal management features and performance stats.

BYD Shakes the EV World: 2nd Gen Blade Battery and 5-Minute Flash Charging Explained

BYD Blade Battery and FLASH Charging technology has revolutionized EV charging with rapid, efficient performance and improved cold-weather capabilities.
Japan power semiconductor merger graphic illustrating integration of Rohm, Mitsubishi Electric, and Toshiba.

Japan's Power Semiconductor Giants Consolidate: Mitsubishi Electric Joins Rohm and Toshiba in Landmark Merger Talks

Japan power semiconductor merger is a significant move involving Mitsubishi Electric, Rohm, and Toshiba aiming for consolidation in the semiconductor market.
Ultrasonic bonding process in solid-state battery manufacturing breakthrough with electrodes showing resistance measurements.

Breakthrough in Solid-State Battery Manufacturing via Ultrasonic Bonding

The solid-state battery manufacturing breakthrough involves a novel ultrasonic bonding technique that enhances battery production efficiency.
Visual representation of Japan semiconductor integration talks with Rohm, Toshiba, and Mitsubishi Electric.

Japan's Power Semiconductor Giants Unite: Rohm, Toshiba, and Mitsubishi Electric Begin Integration Talks

Japan semiconductor integration talks have begun as Rohm, Toshiba, and Mitsubishi Electric unite. This collaboration aims to enhance power device technologies.
Molybdenum precursors for semiconductors in a high-tech lab environment with advanced machinery.

JX Metals ramps up Molybdenum precursors for next-generation semiconductors

Molybdenum precursors for semiconductors are becoming crucial as JX Nippon Mining and Metals ramps up production to meet demand in the tech industry.