1, Ultra Thinning / Ultra Flat
MEMS / SENSOR / IGBT / SAW / SOI / GWSS / Polish Wafer / Cavity etc;
Ultra-thin processing such as thickness 1-10um;
Silicon wafer is ultra-thinned to about 5um;
Ultra-thin LT Wafer to about 1um;
2, Wafer Cleaning
Particle:≦10ea/WF(≧0.3μm)
Metal contamination after cleaning 
3, Edge Grining
Knife edge prevention processing
Processing Wafer Size: 4・5・6・8inch
4, Coating Services
Substrates: Silicon wafers (Si), Aluminum oxide (Al₂O₃), Aluminum nitride (AlN), Quartz (SiO₂), Sapphire (Al₂O₃)
Metallic Films: Au, Ag, C, Al, Pt, Ni, Ti, Cu, In, W, TiW, Zn, Mo, Ta, Nb, etc.
Non-Metallic Films: Si, SiO₂, SiN, Al₂O₃, MgF₂, ITO, Ta₂O₅, etc.
Film Thickness: 5nm - 4000nm
