Silicon Nitride Thermal Substrate with Copper Cladding IGBT SiN Heat Sink - Soka Technology
Silicon Nitride Thermal Substrate with Copper Cladding IGBT SiN Heat Sink - Soka Technology

SOKA TECHNOLOGY

Silicon Nitride Thermal Substrate with Copper Cladding IGBT SiN Heat Sink

Angebotspreis$690.00
尺寸:114×114×0.32mm
Copper Layer:0.5mm
Quantity:10
Menge:
♦️ High-quality silicon nitride conductive substrate for IGBT etc.
♦️ Provide small quantities, special specifications products, and customized services.
♦️Global shipping, secure payment, large inventory.
♦️Minimum delivery time within 1 week. Shipped by FedEx, DHL,UPS, etc.
Copper-clad Si3N4 Substrate Specification:
  • Size: 114×114×0.32mm / 190×138×0.32mm ;
  • Thermal conductivity (25 ℃):  ≥85 W/(m•k);
  • Copper Layer: 0.5mm(Both Side);
  • Surface roughness: ≤1Ra ;
  • Bulk density: 3.20 ± 0.05 g/cm3 ;
  • Modulus of elasticity: 300~320 Gpa ;
  • Poisson's ratio: ≤0.29;
  • Vickers hardness: ≥14.2 Gpa ;
  • Coefficient of thermal expansion(25 ℃ ~ 500 ℃): 3.0~3.2(10-6/℃);
  • Fracture toughness: 6.0~7.0 MPa;
  • Bending strength (three-point bending): 700~800 MPa;
  • Production time: 3 weeks


Silicon nitride thermal conductive substrates are widely used in the fields of LED, microelectronic welding and other fields, power transmitters, photovoltaic devices, IGBT modules, semiconductor packaging substrates, other high-power optoelectronics, and semiconductor devices.



Coupon

Coupon code: SKMX6STT8TFX
2% Discount

Coupon

Coupon code: SKMX6STT8TFX
2% Discount

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Customer Support

Phone:  +81-368203586
WhatsApp: +1-3152162986
Telegram:+1-3152162986
Wechat:  +1-3152162986
JP-Mail: info@sokatec.com
UK-Mail: elsa@sokatec.com
KR-Mail: kim@sokatec.com

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Payments

We accept payments by Credit card, PayPal, Bank transfer etc.

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Contact: Sophie
sophie@sokatec.com
Tel:+1-6463916255

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elsa@sokatec.com
Tel:+44-7972294236

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sales@sokatec.com
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kim@sokatec.com
Tel:+82-1090065688

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Tel:+91-9488669046

Vietnam

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nguyen@sokatec.com
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