Takatori Launches MWS-SiC 12F Wire Saw for Next-Generation 12-Inch Silicon Carbide Wafers

Takatori Corporation has officially developed the MWS-SiC 12F, a high-precision wire saw designed to slice twelve-inch silicon carbide ingots. As the power semiconductor industry moves toward larger wafer sizes to boost yield and lower device costs, twelve-inch silicon carbide fabrication is expected to gain significant traction between twenty thirty and twenty thirty-two. To capture this upcoming growth cycle, Takatori plans to roll out staged marketing initiatives starting in twenty twenty-six, targeting research and development deliveries to key customers in the United States, mainland China, and Taiwan before the end of twenty twenty-six.

While demand for traditional six-inch and eight-to-ten-inch slicing machinery has entered a plateau, global chipmakers are increasingly prioritizing twelve-inch equipment. To address structural limitations in existing tools, Takatori replaced the heavy, dual-axis main rollers with a newly designed four-axis spindle mechanism. This architecture supports ingots up to fourteen inches, increases mechanical structural rigidity by forty percent compared to previous models, and delivers higher precision during slicing operations.

In addition, the MWS-SiC 12F enhances smart factory integration. The system fully automates the replacement of work rollers and wire spools using automated guided vehicles and robotic arms, eliminating heavy manual labor and significantly improving operational productivity.