Silicon Nitride Thermal Conductive Si3N4 Ceramics Substrate - Soka Technology
Silicon Nitride Thermal Conductive Si3N4 Heat Sink Ceramics Substrate
Silicon Nitride Thermal Conductive Si3N4 Heat Sink Ceramics Substrate

SOKA TECHNOLOGY

Silicon Nitride Thermal Conductive Si3N4 Heat Sink Ceramics Substrate

Angebotspreis$450.00
尺寸:114×114×0.32mm
Quantity:10
Menge:
♦️ High-quality silicon nitride conductive substrate for IGBT etc.
♦️ Provide small quantities, special specifications products, and customized services.
♦️Global shipping, secure payment, large inventory.
♦️Minimum delivery time within 1 week. Shipped by FedEx, DHL,UPS, etc.
Si3N4 Substrate Specification:
  • Size: 114×114×0.32mm / 190×138×0.32mm ;
  • Thermal conductivity (25 ℃):  ≥80 W/(m•k);
  • Surface roughness: ≤0.8Ra ;
  • Bulk density: 3.20 ± 0.05 g/cm3 ;
  • Modulus of elasticity: 300~320 Gpa ;
  • Poisson's ratio: ≤0.29;
  • Vickers hardness: ≥14.2 Gpa ;
  • Coefficient of thermal expansion(25 ℃ ~ 500 ℃): 3.0~3.2(10-6/℃);
  • Fracture toughness: 6.0~7.0 MPa;
  • Bending strength (three-point bending): 700~800 MPa;


Silicon nitride thermal conductive substrates are widely used in the fields of LED, microelectronic welding and other fields, power transmitters, photovoltaic devices, IGBT modules, semiconductor packaging substrates, other high-power optoelectronics, and semiconductor devices.



Gutschein

Gutscheincode: SKMX6STT8TFX
2% Rabatt

Gutschein

Gutscheincode: SKMX6STT8TFX
2% Rabatt

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Kontoinhaber: Soka Technology Ltd

Zahlungen

Wir akzeptieren Zahlungen per Kreditkarte, PayPal, Banküberweisung usw.

Bankverbindung:
Bankname: Sumitomo Mitsui Banking Corporation
Filialname: Tsudanumaekimae Branch
Bankadresse:7-9-18, Yatsu Narashino-shi, Chibaken, Japan
SWIFT:SMBCJPJT
Kontonummer: 8910134352
Kontoinhaber: Soka Technology Ltd

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