Wafer Processing
Dicing, Coasting, Ultra Thinning, Ultra Flat,
Cleaning, Edge Grind, Reclaim, EPI, etc.
Wafer Variety
Silicon(1~18inch, CZ, FZ, Oxide, SiN, Metal layer)
SiC, GaN, GaAs, InP, GaP, SOI, Sapphire,
Quartz, Lithium niobate, Lithium titanate, etc.
Collection Categories
Soka Technology
One stop | Globalization | Specialization
Semiconductor Wafers | Solar Products | Ceramics Products
Serving high-tech and new energy industries